Piezoelectric bimorph response with imperfect bonding conditions

Abstract

The effect of the finite stiffness bonding between the piezoelectric plies of bimorph devices has been investigated. A boundary integral formulation for piezoelasticity, based on a multidomain technique with imperfect interface conditions, has been developed. The imperfect interface conditions between the piezoelectric layers are described in terms of linear relations between the interface tractions, in normal and tangential directions, and the respective discontinuity in displacements. Continuity of the electric potential at the interface is also assumed and an iterative procedure is implemented to avoid interface interference. Numerical analysis has been performed on bimorph configurations with series arrangement and the influence of the adhesive is pointed out for both sensing and actuating functions.